Qualmax offers a variety of semiconductor test socket for different device types not only
for the advanced packages like BGA/LGA,
QFN/MLF and POP/PIP but also for the conventional packages like PLCC, SOP and QFP.
There is an increasing demand for wafer level testing in the semiconductor industry
Qualmax provides wafer-level chip scale package (WLCSP) test sockets for vertical probing applications
Kelvin socket eliminates Cres error with 2 isolated probes.
Minimum pitch is down to 0.35mm pitch full array.
Qualmax Kelvin probes are excellent in quality, are low cost and are easy to replace through a drop-in replacement.